WAFER TRANSFER SYSTEM

To provide a wafer transfer system capable of preventing foreign matter from adhering to a wafer during transporting the wafer.SOLUTION: A wafer transfer system 10 includes: a robot (conveyance mechanism) 20 that conveys wafer 1; a clean chamber 30; and a fan (first blower mechanism) 40 that forms a...

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1. Verfasser: OTSUKI TAKAYUKI
Format: Patent
Sprache:eng ; jpn
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Zusammenfassung:To provide a wafer transfer system capable of preventing foreign matter from adhering to a wafer during transporting the wafer.SOLUTION: A wafer transfer system 10 includes: a robot (conveyance mechanism) 20 that conveys wafer 1; a clean chamber 30; and a fan (first blower mechanism) 40 that forms an airflow from the ceiling 31 to the bottom 32 of the clean chamber 30. The robot 20 includes: a hand unit 22 that holds a wafer 1; a fan (second blower mechanism) 70 that, when the hand unit 22 holds the wafer 1, forms an airflow from the bottom surface 1b side of the wafer 1 to the bottom 32 of the clean chamber 30; and a control unit that controls the drive state of the fan 70 depending on the presence or absence of the wafer 1 held by the hand unit 22.SELECTED DRAWING: Figure 3 【課題】ウエハを搬送する際、ウエハへの異物の付着を防止する。【解決手段】ウエハ搬送装置10は、ウエハ1を搬送するロボット(搬送機構部)20と、クリーン室30と、クリーン室30の天井部31から底部32側に向かう気流を形成するファン(第1送風機構部)40と、を有する。ロボット20は、ウエハ1を保持するハンド部22と、ハンド部22がウエハ1を保持した状態の時、ウエハ1の下面1b側からクリーン室30の底部32に向かう気流を形成するファン(第2送風機構部)70と、ハンド部22によるウエハ1の保持の有無に応じて、ファン70の駆動状態を制御する制御部と、を備える。【選択図】図3