WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME

To avoid the problems of thinning of an electrolytic copper plating pattern and delamination of the electrolytic copper plating pattern owing to undercutting of a seed layer when removing a seed layer by etching, thereby providing a wiring board which achieves both of fine wiring formability and ins...

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Bibliographische Detailangaben
1. Verfasser:	TANABE RYOMA
Format:	Patent
Sprache:	eng ; jpn
Schlagworte:	BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:	To avoid the problems of thinning of an electrolytic copper plating pattern and delamination of the electrolytic copper plating pattern owing to undercutting of a seed layer when removing a seed layer by etching, thereby providing a wiring board which achieves both of fine wiring formability and insulation reliability, and a method for manufacturing the same.SOLUTION: A wiring board comprises: a seed layer; an electrolytic copper plating pattern arranged on the seed layer; and a protection film layer covering side faces of the electrolytic copper plating pattern. A method for manufacturing the wiring board comprises a step of forming a protection film layer on side walls and top face of the electrolytic copper plating pattern before a step of etching the seed layer.SELECTED DRAWING: Figure 3 【課題】シード層をエッチング除去する際に電解銅めっきパターンの細りおよびシード層のアンダーカットによる電解銅めっきパターンが剥離する問題を回避し、微細配線形成性と絶縁信頼性を両立する配線基板とその製造方法を提供することを目的とする。【解決手段】シード層と、このシード層の上に配置された電解銅めっきパターンと、この電解銅めっきパターンの側面を被覆する保護膜層とを、有することを特徴とする配線基板。ならびにシード層エッチング工程の前に前記電解銅めっきパターン側壁と上面に保護膜層形成工程を有することを特徴とする配線基板の製造方法。【選択図】図３