WIRING BOARD, ELECTRONIC APPARATUS, AND ELECTRONIC MODULE

To provide a wiring board having a SiC substrate, a NiSi layer ohmically joined to the SiC substrate, and a conductor film on the NiSi layer, and prevent interlayer separation of the films; and to provide an electronic apparatus and an electronic module having high reliability.SOLUTION: The wiring b...

Ausführliche Beschreibung

Bibliographische Detailangaben

1. Verfasser:	ITO SEIICHIRO
Format:	Patent
Sprache:	eng ; jpn
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS
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