WIRING BOARD, ELECTRONIC APPARATUS, AND ELECTRONIC MODULE
To provide a wiring board having a SiC substrate, a NiSi layer ohmically joined to the SiC substrate, and a conductor film on the NiSi layer, and prevent interlayer separation of the films; and to provide an electronic apparatus and an electronic module having high reliability.SOLUTION: The wiring b...
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| creator | ITO SEIICHIRO |
| description | To provide a wiring board having a SiC substrate, a NiSi layer ohmically joined to the SiC substrate, and a conductor film on the NiSi layer, and prevent interlayer separation of the films; and to provide an electronic apparatus and an electronic module having high reliability.SOLUTION: The wiring board (1) comprises: a SiC substrate (10) that has a principal surface (S1); a NiSi layer (11A) that is ohmically joined to a partial range of the principal surface; and a conduction film (20A) that is located on the NiSi layer and the principal surface. An electronic apparatus comprises: the wiring board (1); and an electronic component mounted on the wiring board. The electronic module comprises: the electronic apparatus; and a substrate for a module that has the electronic apparatus mounted thereon.SELECTED DRAWING: Figure 1
【課題】ＳｉＣ基板と、ＳｉＣ基板にオーミック接合されるＮｉＳｉ層と、ＮｉＳｉ層上の導体膜とを有する配線基板において、各膜の層間剥離を抑制する。高い信頼性を有する電子装置及び電子モジュールを提供する。【解決手段】この配線基板（１）は、主面（Ｓ１）を有するＳｉＣ基板（１０）と、主面の一部の範囲にオーミック接合されたＮｉＳｉ層（１１Ａ）と、ＮｉＳｉ層上から主面上にかけて位置する導体膜（２０Ａ）とを備える。電子装置は、配線基板（１）と、配線基板に搭載される電子部品とを備える。電子モジュールは、上記電子装置と、電子装置を搭載するモジュール用基板とを備える。【選択図】図１ |
| format | Patent |
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【課題】ＳｉＣ基板と、ＳｉＣ基板にオーミック接合されるＮｉＳｉ層と、ＮｉＳｉ層上の導体膜とを有する配線基板において、各膜の層間剥離を抑制する。高い信頼性を有する電子装置及び電子モジュールを提供する。【解決手段】この配線基板（１）は、主面（Ｓ１）を有するＳｉＣ基板（１０）と、主面の一部の範囲にオーミック接合されたＮｉＳｉ層（１１Ａ）と、ＮｉＳｉ層上から主面上にかけて位置する導体膜（２０Ａ）とを備える。電子装置は、配線基板（１）と、配線基板に搭載される電子部品とを備える。電子モジュールは、上記電子装置と、電子装置を搭載するモジュール用基板とを備える。【選択図】図１</description><language>eng ; jpn</language><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; PRINTED CIRCUITS</subject><creationdate>2020</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20201203&DB=EPODOC&CC=JP&NR=2020194869A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20201203&DB=EPODOC&CC=JP&NR=2020194869A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>ITO SEIICHIRO</creatorcontrib><title>WIRING BOARD, ELECTRONIC APPARATUS, AND ELECTRONIC MODULE</title><description>To provide a wiring board having a SiC substrate, a NiSi layer ohmically joined to the SiC substrate, and a conductor film on the NiSi layer, and prevent interlayer separation of the films; and to provide an electronic apparatus and an electronic module having high reliability.SOLUTION: The wiring board (1) comprises: a SiC substrate (10) that has a principal surface (S1); a NiSi layer (11A) that is ohmically joined to a partial range of the principal surface; and a conduction film (20A) that is located on the NiSi layer and the principal surface. An electronic apparatus comprises: the wiring board (1); and an electronic component mounted on the wiring board. The electronic module comprises: the electronic apparatus; and a substrate for a module that has the electronic apparatus mounted thereon.SELECTED DRAWING: Figure 1
【課題】ＳｉＣ基板と、ＳｉＣ基板にオーミック接合されるＮｉＳｉ層と、ＮｉＳｉ層上の導体膜とを有する配線基板において、各膜の層間剥離を抑制する。高い信頼性を有する電子装置及び電子モジュールを提供する。【解決手段】この配線基板（１）は、主面（Ｓ１）を有するＳｉＣ基板（１０）と、主面の一部の範囲にオーミック接合されたＮｉＳｉ層（１１Ａ）と、ＮｉＳｉ層上から主面上にかけて位置する導体膜（２０Ａ）とを備える。電子装置は、配線基板（１）と、配線基板に搭載される電子部品とを備える。電子モジュールは、上記電子装置と、電子装置を搭載するモジュール用基板とを備える。【選択図】図１</description><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</subject><subject>PRINTED CIRCUITS</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2020</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZLAM9wzy9HNXcPJ3DHLRUXD1cXUOCfL383RWcAwIcAxyDAkN1lFw9HNBlvH1dwn1ceVhYE1LzClO5YXS3AxKbq4hzh66qQX58anFBYnJqXmpJfFeAUYGRgaGliYWZpaOxkQpAgDFySkQ</recordid><startdate>20201203</startdate><enddate>20201203</enddate><creator>ITO SEIICHIRO</creator><scope>EVB</scope></search><sort><creationdate>20201203</creationdate><title>WIRING BOARD, ELECTRONIC APPARATUS, AND ELECTRONIC MODULE</title><author>ITO SEIICHIRO</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_JP2020194869A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng ; jpn</language><creationdate>2020</creationdate><topic>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</topic><topic>PRINTED CIRCUITS</topic><toplevel>online_resources</toplevel><creatorcontrib>ITO SEIICHIRO</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>ITO SEIICHIRO</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>WIRING BOARD, ELECTRONIC APPARATUS, AND ELECTRONIC MODULE</title><date>2020-12-03</date><risdate>2020</risdate><abstract>To provide a wiring board having a SiC substrate, a NiSi layer ohmically joined to the SiC substrate, and a conductor film on the NiSi layer, and prevent interlayer separation of the films; and to provide an electronic apparatus and an electronic module having high reliability.SOLUTION: The wiring board (1) comprises: a SiC substrate (10) that has a principal surface (S1); a NiSi layer (11A) that is ohmically joined to a partial range of the principal surface; and a conduction film (20A) that is located on the NiSi layer and the principal surface. An electronic apparatus comprises: the wiring board (1); and an electronic component mounted on the wiring board. The electronic module comprises: the electronic apparatus; and a substrate for a module that has the electronic apparatus mounted thereon.SELECTED DRAWING: Figure 1
【課題】ＳｉＣ基板と、ＳｉＣ基板にオーミック接合されるＮｉＳｉ層と、ＮｉＳｉ層上の導体膜とを有する配線基板において、各膜の層間剥離を抑制する。高い信頼性を有する電子装置及び電子モジュールを提供する。【解決手段】この配線基板（１）は、主面（Ｓ１）を有するＳｉＣ基板（１０）と、主面の一部の範囲にオーミック接合されたＮｉＳｉ層（１１Ａ）と、ＮｉＳｉ層上から主面上にかけて位置する導体膜（２０Ａ）とを備える。電子装置は、配線基板（１）と、配線基板に搭載される電子部品とを備える。電子モジュールは、上記電子装置と、電子装置を搭載するモジュール用基板とを備える。【選択図】図１</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS |
| title | WIRING BOARD, ELECTRONIC APPARATUS, AND ELECTRONIC MODULE |
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