CIRCUIT BOARD MANUFACTURING METHOD, SUBSTRATE, AND CIRCUIT BOARD

To provide a circuit board manufacturing method capable of producing a circuit board having excellent insulation reliability and easily removing unnecessary resin at the time of forming an insulating layer, a substrate used for the same, and a circuit board using the substrate.SOLUTION: A circuit board manufacturing method includes a step of introducing a resin composition through a flow path into a space between a circuit with a protective material and a substrate facing each other, and sealing the space with a cured product of the resin composition, and the circuit with the protective material includes a circuit and a protective material arranged between the circuits, and in the sealing step, a part of the substrate faces the flow path, and the substrate includes a first region which is a region facing the circuit with the protective material and a second region which is at least a part of a region facing the flow path, and in the sealing step, the adhesiveness to the cured product in the second region is lower than the adhesiveness to the cured product in the first region.SELECTED DRAWING: Figure 1 【課題】絶縁信頼性に優れる回路基板を作製可能であり、絶縁層の成形時に不要な樹脂を簡便に除去できる回路基板の製造方法、これに用いられる基板、及び当該基板を用いた回路基板を提供する。【解決手段】回路基板の製造方法は、対向する保護材付き回路と基板との間の空間に、流路を通して樹脂組成物を導入し、前記空間を前記樹脂組成物の硬化物で封止する工程を含み、前記保護材付き回路は、回路と、前記回路の間に配置された保護材とを有し、前記封止する工程において、前記基板の一部は前記流路に面しており、前記基板は、前記保護材付き回路と対向する領域である第一の領域と、前記流路に面する領域の少なくとも一部である第二の領域とを有し、前記封止する工程において、前記第二の領域における前記硬化物に対する接着性は、前記第一の領域における前記硬化物に対する接着性よりも低い。【選択図】図１