METHOD FOR DIVIDING WORKPIECE, METHOD FOR DETECTING CHIP DIMENSION AND CUTTING DEVICE
To provide a method for dividing a workpiece capable of easily detecting the dimensions of a chip.SOLUTION: A method for dividing a workpiece for dividing a workpiece into a plurality of chips to detect the actual dimensions of a chip by a cutting device including holding means for holding a workpie...
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Format: | Patent |
Sprache: | eng ; jpn |
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Zusammenfassung: | To provide a method for dividing a workpiece capable of easily detecting the dimensions of a chip.SOLUTION: A method for dividing a workpiece for dividing a workpiece into a plurality of chips to detect the actual dimensions of a chip by a cutting device including holding means for holding a workpiece having an electrode in each of a plurality of areas partitioned by a plurality of division schedule lines crossing each other, cutting means mounted with a cutting blade for cutting the workpiece held by the holding means, imaging means for imaging the workpiece and control means for controlling the holding means and the cutting means, includes: a division step for cutting the workpiece along the division schedule lines by the cutting blade to divide the workpiece into a plurality of chips; an image acquisition step for imaging a chip with the imaging means to acquire an image of the chip; and a detection step for detecting the actual dimensions of the chip with the control means on the basis of the image.SELECTED DRAWING: Figure 1
【課題】チップの寸法を簡易に検出することを可能とする被加工物の分割方法を提供する。【解決手段】互いに交差する複数の分割予定ラインによって区画された複数の領域にそれぞれ電極を有する被加工物を保持する保持手段と、保持手段によって保持された被加工物を切削する切削ブレードが装着される切削手段と、被加工物を撮像する撮像手段と、保持手段と切削手段とを制御する制御手段と、を備える切削装置で、被加工物を複数のチップに分割してチップの実寸法を検出する被加工物の分割方法であって、被加工物を、切削ブレードで分割予定ラインに沿って切削して複数のチップに分割する分割ステップと、チップを撮像手段で撮像して、チップの画像を取得する画像取得ステップと、画像に基づいて、チップの実寸法を制御手段で検出する検出ステップと、を備える。【選択図】図1 |
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