ELECTROLYTIC COPPER FOIL, METHOD OF MANUFACTURING THE SAME, AND LITHIUM ION SECONDARY BATTERY

To provide an electrolytic copper foil, a method of manufacturing the electrolytic copper foil, and a lithium ion secondary battery.SOLUTION: An electrolytic copper foil includes a raw foil layer having a first surface and a second surface facing the first surface. According to X-ray diffraction spe...

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Bibliographische Detailangaben
Hauptverfasser: CHEN CHIA-LING, LIN SHI-QING, TZOU MING-JEN
Format: Patent
Sprache:eng ; jpn
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Zusammenfassung:To provide an electrolytic copper foil, a method of manufacturing the electrolytic copper foil, and a lithium ion secondary battery.SOLUTION: An electrolytic copper foil includes a raw foil layer having a first surface and a second surface facing the first surface. According to X-ray diffraction spectrum of the first surface, a ratio value between the diffraction peak intensity I (200) of a (200) crystal surface in the first surface and the diffraction peak intensity I (111) of a (111) crystal surface in the first surface is in the range of 0.5 to 2.0. According to X-ray diffraction spectrum of the second surface, a ratio value between the diffraction peak intensity I (200) of the (200) crystal surface in the second surface and the diffraction peak intensity I (111) of the (111) crystal surface in the second surface is in the range of 0.5 to 2.0.SELECTED DRAWING: Figure 2 【課題】本発明は電解銅箔、その製造方法、及びリチウムイオン二次電池を開示する。【解決手段】電解銅箔は、第1表面と、第1表面に対合する第2表面とを有する生箔層を含む。第1表面のX線回折スペクトルにおいて、第1表面における(200)結晶面の回折ピーク強度I(200)と第1表面における(111)結晶面の回折ピーク強度I(111)の比値が0.5から2.0の間である。第2表面のX線回折スペクトルにおいて、第2表面における(200)結晶面の回折ピーク強度I(200)と第2表面における(111)結晶面の回折ピーク強度I(111)の比値も0.5から2.0の間である。【選択図】図2