MANUFACTURING METHOD OF LIGHT-EMITTING DEVICE
To provide a manufacturing method of a light-emitting device that suppresses peeling between a resin after curing and a substrate.SOLUTION: A manufacturing method of a light-emitting device includes a step of preparing a substrate having an electrode having a metal layer containing silver or gold on...
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| Format: | Patent |
| Sprache: | eng ; jpn |
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| Zusammenfassung: | To provide a manufacturing method of a light-emitting device that suppresses peeling between a resin after curing and a substrate.SOLUTION: A manufacturing method of a light-emitting device includes a step of preparing a substrate having an electrode having a metal layer containing silver or gold on the surface, a removal step of removing some of silver or gold particles on the surface of the electrode with a solution containing iodine ions, a step of arranging a light emitting element on the electrode, and a step of placing a liquid resin material using a silicone resin as a base material, on the surface of the electrode, and heating the resin material to obtain a cured resin portion.SELECTED DRAWING: Figure 2C
【課題】硬化後の樹脂と基板との剥離を抑制する発光装置の製造方法を提供する。【解決手段】表面に銀又は金を含む金属層を有する電極を備える基板を準備する工程と、電極の表面にある銀粒子または金粒子の一部をヨウ素イオンを含む溶液を用いて除去する除去工程と、電極上に発光素子を配置する工程と、電極の表面上にシリコーン樹脂を母材とする液状の樹脂材料を配置し、樹脂材料を加熱して硬化した樹脂部を得る工程と、を備える、発光装置の製造方法。【選択図】図２Ｃ |
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