GOLD-COATED SILVER BONDING WIRE AND MANUFACTURING METHOD THEREOF, AND SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

To provide a gold-coated silver bonding wire capable of suppressing a short circuit or the like due to ion migration between ball compression portions.SOLUTION: A gold-coated silver bonding wire 1 includes a core material 2 containing silver as a main component and a coating layer 3 provided on the...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	KAWANO SHOTA, YASUTOKU YUKI, SAKITA YUSUKE
Format:	Patent
Sprache:	eng ; jpn
Schlagworte:	ALLOYS BASIC ELECTRIC ELEMENTS CHEMISTRY ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY FERROUS OR NON-FERROUS ALLOYS METALLURGY SEMICONDUCTOR DEVICES TREATMENT OF ALLOYS OR NON-FERROUS METALS
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