ELECTRONIC CIRCUIT DEVICE AND MANUFACTURING METHOD THEREFOR

To provide an electronic circuit device and manufacturing method therefor, capable of easily achieving high-density mounting and airtight structure.SOLUTION: An electronic component 6a is packaged in a recessed part 2 formed into one surface of package substrate (aggregate substrate 1) and sealed wi...

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Hauptverfasser:	MATSUNOBE AKIHIKO, OGATA TOSHIHIRO
Format:	Patent
Sprache:	eng ; jpn
Schlagworte:	BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSIONOF CHEMICAL INTO ELECTRICAL ENERGY SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:	To provide an electronic circuit device and manufacturing method therefor, capable of easily achieving high-density mounting and airtight structure.SOLUTION: An electronic component 6a is packaged in a recessed part 2 formed into one surface of package substrate (aggregate substrate 1) and sealed with sealing resin 7, thereby packaging the electronic component under an airtight state. At the other surface of the package substrate, other electronic components 6b-6d are packaged for high-density packaging.SELECTED DRAWING: Figure 8 【課題】簡便に高密度実装、気密構造を実現することができる電子回路装置およびその製造方法を提供する。【解決手段】実装基板（集合基板１）の一方の面に形成した凹部２内に電子部品６ａを実装して封止樹脂７で封止し、電子部品を気密状態で実装を可能とする。実装基板の他方の面には、別の電子部品６ｂ〜６ｄを実装し、高密度実装を可能とする。【選択図】図８