SEMICONDUCTOR DEVICE AND APPARATUS
To provide an advantageous technology for improving the reliability of a semiconductor device.SOLUTION: A device plate 10 is disposed between a facing plate 20 and a circuit plate 30. The circuit plate 30 has an overlapping portion 31 that overlaps with the device plate 10 and a non-overlapping port...
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| creator | HACHISU TAKAHIRO |
| description | To provide an advantageous technology for improving the reliability of a semiconductor device.SOLUTION: A device plate 10 is disposed between a facing plate 20 and a circuit plate 30. The circuit plate 30 has an overlapping portion 31 that overlaps with the device plate 10 and a non-overlapping portion 32 that does not overlap the device plate 10. A resin member 16 in contact with the non-overlapping portion 32 of the device plate 10 and the circuit plate 30 is in contact with a contact region 21 of a side surface 200 of the facing plate 20 and not in contact with a non-contact region 22 of the side surface 200 of the facing plate 20.SELECTED DRAWING: Figure 1
【課題】 半導体装置の信頼性を向上するうえで有利な技術を提供する。【解決手段】 対向板２０と回路板３０との間にデバイス板１０が配されており、回路板３０は、デバイス板１０に重なる重複部分３１と、デバイス板１０に重ならない非重複部分３２と、を有し、デバイス板１０および回路板３０の非重複部分３２に接触する樹脂部材１６は、対向板２０の側面２００の接触領域２１に接触し、かつ、対向板２０の側面２００の非接触領域２２に接触しない。【選択図】 図１ |
| format | Patent |
| fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_JP2020167347A</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>JP2020167347A</sourcerecordid><originalsourceid>FETCH-epo_espacenet_JP2020167347A3</originalsourceid><addsrcrecordid>eNrjZFAKdvX1dPb3cwl1DvEPUnBxDfN0dlVw9HNRcAwIcAxyDAkN5mFgTUvMKU7lhdLcDEpuriHOHrqpBfnxqcUFicmpeakl8V4BRgZGBoZm5sYm5o7GRCkCAIJfIvA</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>SEMICONDUCTOR DEVICE AND APPARATUS</title><source>esp@cenet</source><creator>HACHISU TAKAHIRO</creator><creatorcontrib>HACHISU TAKAHIRO</creatorcontrib><description>To provide an advantageous technology for improving the reliability of a semiconductor device.SOLUTION: A device plate 10 is disposed between a facing plate 20 and a circuit plate 30. The circuit plate 30 has an overlapping portion 31 that overlaps with the device plate 10 and a non-overlapping portion 32 that does not overlap the device plate 10. A resin member 16 in contact with the non-overlapping portion 32 of the device plate 10 and the circuit plate 30 is in contact with a contact region 21 of a side surface 200 of the facing plate 20 and not in contact with a non-contact region 22 of the side surface 200 of the facing plate 20.SELECTED DRAWING: Figure 1
【課題】 半導体装置の信頼性を向上するうえで有利な技術を提供する。【解決手段】 対向板２０と回路板３０との間にデバイス板１０が配されており、回路板３０は、デバイス板１０に重なる重複部分３１と、デバイス板１０に重ならない非重複部分３２と、を有し、デバイス板１０および回路板３０の非重複部分３２に接触する樹脂部材１６は、対向板２０の側面２００の接触領域２１に接触し、かつ、対向板２０の側面２００の非接触領域２２に接触しない。【選択図】 図１</description><language>eng ; jpn</language><subject>BASIC ELECTRIC ELEMENTS ; ELECTRIC COMMUNICATION TECHNIQUE ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; PICTORIAL COMMUNICATION, e.g. TELEVISION ; SEMICONDUCTOR DEVICES</subject><creationdate>2020</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20201008&DB=EPODOC&CC=JP&NR=2020167347A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20201008&DB=EPODOC&CC=JP&NR=2020167347A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>HACHISU TAKAHIRO</creatorcontrib><title>SEMICONDUCTOR DEVICE AND APPARATUS</title><description>To provide an advantageous technology for improving the reliability of a semiconductor device.SOLUTION: A device plate 10 is disposed between a facing plate 20 and a circuit plate 30. The circuit plate 30 has an overlapping portion 31 that overlaps with the device plate 10 and a non-overlapping portion 32 that does not overlap the device plate 10. A resin member 16 in contact with the non-overlapping portion 32 of the device plate 10 and the circuit plate 30 is in contact with a contact region 21 of a side surface 200 of the facing plate 20 and not in contact with a non-contact region 22 of the side surface 200 of the facing plate 20.SELECTED DRAWING: Figure 1
【課題】 半導体装置の信頼性を向上するうえで有利な技術を提供する。【解決手段】 対向板２０と回路板３０との間にデバイス板１０が配されており、回路板３０は、デバイス板１０に重なる重複部分３１と、デバイス板１０に重ならない非重複部分３２と、を有し、デバイス板１０および回路板３０の非重複部分３２に接触する樹脂部材１６は、対向板２０の側面２００の接触領域２１に接触し、かつ、対向板２０の側面２００の非接触領域２２に接触しない。【選択図】 図１</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>ELECTRIC COMMUNICATION TECHNIQUE</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>PICTORIAL COMMUNICATION, e.g. TELEVISION</subject><subject>SEMICONDUCTOR DEVICES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2020</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZFAKdvX1dPb3cwl1DvEPUnBxDfN0dlVw9HNRcAwIcAxyDAkN5mFgTUvMKU7lhdLcDEpuriHOHrqpBfnxqcUFicmpeakl8V4BRgZGBoZm5sYm5o7GRCkCAIJfIvA</recordid><startdate>20201008</startdate><enddate>20201008</enddate><creator>HACHISU TAKAHIRO</creator><scope>EVB</scope></search><sort><creationdate>20201008</creationdate><title>SEMICONDUCTOR DEVICE AND APPARATUS</title><author>HACHISU TAKAHIRO</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_JP2020167347A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng ; jpn</language><creationdate>2020</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>ELECTRIC COMMUNICATION TECHNIQUE</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>PICTORIAL COMMUNICATION, e.g. TELEVISION</topic><topic>SEMICONDUCTOR DEVICES</topic><toplevel>online_resources</toplevel><creatorcontrib>HACHISU TAKAHIRO</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>HACHISU TAKAHIRO</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>SEMICONDUCTOR DEVICE AND APPARATUS</title><date>2020-10-08</date><risdate>2020</risdate><abstract>To provide an advantageous technology for improving the reliability of a semiconductor device.SOLUTION: A device plate 10 is disposed between a facing plate 20 and a circuit plate 30. The circuit plate 30 has an overlapping portion 31 that overlaps with the device plate 10 and a non-overlapping portion 32 that does not overlap the device plate 10. A resin member 16 in contact with the non-overlapping portion 32 of the device plate 10 and the circuit plate 30 is in contact with a contact region 21 of a side surface 200 of the facing plate 20 and not in contact with a non-contact region 22 of the side surface 200 of the facing plate 20.SELECTED DRAWING: Figure 1
【課題】 半導体装置の信頼性を向上するうえで有利な技術を提供する。【解決手段】 対向板２０と回路板３０との間にデバイス板１０が配されており、回路板３０は、デバイス板１０に重なる重複部分３１と、デバイス板１０に重ならない非重複部分３２と、を有し、デバイス板１０および回路板３０の非重複部分３２に接触する樹脂部材１６は、対向板２０の側面２００の接触領域２１に接触し、かつ、対向板２０の側面２００の非接触領域２２に接触しない。【選択図】 図１</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | BASIC ELECTRIC ELEMENTS ELECTRIC COMMUNICATION TECHNIQUE ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY PICTORIAL COMMUNICATION, e.g. TELEVISION SEMICONDUCTOR DEVICES |
| title | SEMICONDUCTOR DEVICE AND APPARATUS |
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