SEMICONDUCTOR DEVICE AND APPARATUS

To provide an advantageous technology for improving the reliability of a semiconductor device.SOLUTION: A device plate 10 is disposed between a facing plate 20 and a circuit plate 30. The circuit plate 30 has an overlapping portion 31 that overlaps with the device plate 10 and a non-overlapping port...

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Bibliographische Detailangaben
1. Verfasser:	HACHISU TAKAHIRO
Format:	Patent
Sprache:	eng ; jpn
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC COMMUNICATION TECHNIQUE ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY PICTORIAL COMMUNICATION, e.g. TELEVISION SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:	To provide an advantageous technology for improving the reliability of a semiconductor device.SOLUTION: A device plate 10 is disposed between a facing plate 20 and a circuit plate 30. The circuit plate 30 has an overlapping portion 31 that overlaps with the device plate 10 and a non-overlapping portion 32 that does not overlap the device plate 10. A resin member 16 in contact with the non-overlapping portion 32 of the device plate 10 and the circuit plate 30 is in contact with a contact region 21 of a side surface 200 of the facing plate 20 and not in contact with a non-contact region 22 of the side surface 200 of the facing plate 20.SELECTED DRAWING: Figure 1 【課題】半導体装置の信頼性を向上するうえで有利な技術を提供する。【解決手段】対向板２０と回路板３０との間にデバイス板１０が配されており、回路板３０は、デバイス板１０に重なる重複部分３１と、デバイス板１０に重ならない非重複部分３２と、を有し、デバイス板１０および回路板３０の非重複部分３２に接触する樹脂部材１６は、対向板２０の側面２００の接触領域２１に接触し、かつ、対向板２０の側面２００の非接触領域２２に接触しない。【選択図】図１