PHOTOSENSITIVE RESIN COMPOSITION, DRY FILM, CURED PRODUCT, AND ELECTRONIC COMPONENT

To provide a photosensitive resin composition and the like which can give a cured product excellent in reliability such as heat resistance and crack resistance and is excellent in optical characteristics (resolution).SOLUTION: The photosensitive resin composition contains: (A) a curable copolymer re...

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Bibliographische Detailangaben
Hauptverfasser:	UEDA CHIHO, OKADA KAZUYA, KUDOU TOMOYA, SHU SHOTARO, SHIMADA SAWAKO
Format:	Patent
Sprache:	eng ; jpn
Schlagworte:	APPARATUS SPECIALLY ADAPTED THEREFOR CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CINEMATOGRAPHY ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY ELECTROGRAPHY HOLOGRAPHY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS MATERIALS THEREFOR ORIGINALS THEREFOR PHOTOGRAPHY PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES PHYSICS PRINTED CIRCUITS
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Beschreibung
Zusammenfassung:	To provide a photosensitive resin composition and the like which can give a cured product excellent in reliability such as heat resistance and crack resistance and is excellent in optical characteristics (resolution).SOLUTION: The photosensitive resin composition contains: (A) a curable copolymer resin having at least a first repeating unit represented by formula (1) and a second repeating unit represented by formula (2); (B1) an epoxy resin; (B2) a compound having two or more maleimide structures in one molecule; (C) a photopolymerization initiator; and (D) silica in an amount of 25-75 mass% in terms of solid content.SELECTED DRAWING: None 【課題】耐熱性やクラック耐性等の信頼性に優れた硬化物を得ることができ、かつ、光特性（解像性）に優れた感光性樹脂組成物等を提供する。【解決手段】（Ａ）少なくとも式（１）で表される第１繰り返し単位と、式（２）で表される第２繰り返し単位とを有する硬化性共重合樹脂、（Ｂ１）エポキシ樹脂、（Ｂ２）マレイミド構造を１分子中に２つ以上有する化合物、（Ｃ）光重合開始剤、および（Ｄ）シリカを固形分換算で２５〜７５質量％含む感光性樹脂組成物。【選択図】なし