SEALING COMPOSITION AND SEMICONDUCTOR DEVICE

To provide a sealing composition excellent in thermal conductivity of a cured product and moisture resistance reliability in a biased state, and to provide a semiconductor device using it.SOLUTION: A first sealing composition contains an epoxy resin, a curing agent, an inorganic filler, and an unfir...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	HORIE TAKAHIRO, ISHIBASHI KENTA, KANG DONGOL, SEKIGUCHI KAZUHIDE, HORI KEICHI, IKUI NAOKI
Format:	Patent
Sprache:	eng ; jpn
Schlagworte:	BASIC ELECTRIC ELEMENTS CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS SEMICONDUCTOR DEVICES THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS
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