SEALING COMPOSITION AND SEMICONDUCTOR DEVICE

To provide a sealing composition excellent in thermal conductivity of a cured product and moisture resistance reliability in a biased state, and to provide a semiconductor device using it.SOLUTION: A first sealing composition contains an epoxy resin, a curing agent, an inorganic filler, and an unfir...

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Bibliographische Detailangaben
Hauptverfasser:	HORIE TAKAHIRO, ISHIBASHI KENTA, KANG DONGOL, SEKIGUCHI KAZUHIDE, HORI KEICHI, IKUI NAOKI
Format:	Patent
Sprache:	eng ; jpn
Schlagworte:	BASIC ELECTRIC ELEMENTS CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS SEMICONDUCTOR DEVICES THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS
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Beschreibung
Zusammenfassung:	To provide a sealing composition excellent in thermal conductivity of a cured product and moisture resistance reliability in a biased state, and to provide a semiconductor device using it.SOLUTION: A first sealing composition contains an epoxy resin, a curing agent, an inorganic filler, and an unfired hydrotalcite compound having a molar ratio (Mg/Al) of Mg ions to Al ions of 2.4 or more. A second sealing composition contains an epoxy resin, a curing agent, a hydrotalcite compound represented by a general formula (1): Mg1-xAlx(OH)2(CO3)x/2*mH2O, (x and m are independently integers in the formula), and a magnesium-containing compound different from the hydrotalcite compound. A third sealing composition contains an epoxy resin, a curing agent, a hydrotalcite compound represented by the general formula (1), and magnesium oxide, in which the content of the magnesium oxide is 1 pt.mass to 50 pts.mass with respect to 100 pts.mass of the epoxy resin.SELECTED DRAWING: None 【課題】硬化物の熱伝導性と、バイアス印加状態での耐湿信頼性に優れる封止組成物、及びこれを用いた半導体装置を提供する。【解決手段】第一の封止組成物は、エポキシ樹脂と、硬化剤と、無機充填材と、ＭｇイオンとＡｌイオンとのモル比（Ｍｇ／Ａｌ）が２．４以上である未焼成ハイドロタルサイト化合物と、を含む。第二の封止組成物は、エポキシ樹脂と、硬化剤と、一般式（１）：Ｍｇ１−ｘＡｌｘ（ＯＨ）２（ＣＯ３）ｘ／２・ｍＨ２Ｏ（式中、ｘ及びｍは、各々独立に整数である）で表されるハイドロタルサイト化合物と、前記ハイドロタルサイト化合物とは異なるマグネシウム含有化合物と、を含有する。第三の封止組成物は、エポキシ樹脂と、硬化剤と、前記一般式（１）で表されるハイドロタルサイト化合物と、酸化マグネシウムとを含有し、前記酸化マグネシウムの含有量は前記エポキシ樹脂１００質量部に対して１質量部〜５０質量部である。【選択図】なし