CURABLE RESIN COMPOSITION, DRY FILM, CURED PRODUCT AND ELECTRONIC COMPONENT

To provide a curable resin composition capable of obtaining a cured product having excellent resolution and embedding property of a high density wiring pattern, a dry film having a resin layer obtained from the composition, a cured product of the composition or the dry film and an electronic compone...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: UEDA CHIHO, OKADA KAZUYA, KUDOU TOMOYA, SHU SHOTARO, SHIMADA SAWAKO
Format: Patent
Sprache:eng ; jpn
Schlagworte:
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