BREAK DEVICE OF BRITTLE MATERIAL SUBSTRATE AND PARTING SYSTEM

To provide a break device which can efficiently breaks brittle material substrates with end material areas around the product areas.SOLUTION: A break device 1 of brittle material substrate W in which stress is applied to the brittle material substrates W on which scribe lines are formed to divide end material areas from product areas of the brittle material substrates along the scribe lines includes a substrate transfer mechanism 2 for holding and transferring the brittle material substrates W and an end material gripping mechanism 3 for gripping the end material areas of the brittle material substrates, the substrate transfer mechanism 2 has a substrate holding part 222 that holds the brittle material substrates W and a rotating part 221 that rotates the held brittle material substrate W around the axis along the normal of its main surface, and the end material gripping mechanism 3 has a gripping part 310 for gripping the end materials, and the substrate holding part 222 and the gripping part 310 are provided so as to be relatively close to each other.SELECTED DRAWING: Figure 1 【課題】本発明は、製品領域の周囲に端材領域を有する脆性材料基板を効率よくブレイクできるブレイク装置を提供する。【解決手段】スクライブラインが形成された脆性材料基板Ｗに応力を加えて、スクライブラインに沿って脆性材料基板の製品領域から端材領域を分割する脆性材料基板Ｗのブレイク装置１であって、脆性材料基板Ｗを保持して移送する基板移送機構２と、脆性材料基板Ｗの端材領域を把持する端材把持機構３とを備え、基板移送機構２は、脆性材料基板Ｗを保持する基板保持部２２２と保持した脆性材料基板Ｗをその主面の法線に沿った軸回りに回転させる旋回部２２１を有し、端材把持機構３は端材を把持する把持部３１０を有し、基板保持部２２２と把持部３１０とは、相対的に接近離隔可能に設けられている。【選択図】図１