TAPE BONDING DEVICE, AND TAPE BONDING METHOD

To provide a tape bonding device capable of enhancing stability of a pressed state against a surface to be bonded by a pressing portion.SOLUTION: An ATL device 10 is provided with an ATL head 20 for bonding a tape 1 to a surface to be bonded 2a while pressing it, the ATL head 20 is provided with a pressing portion 30 for pressing the tape 1 against the surface to be bonded 2a, a parallel link mechanism 40 for adjusting a pressing state of the pressing portion 30 and a tape transport portion 70 including a feeder 50 for transporting the tape 1 toward a nip point B between the pressing portion 30 and the surface to be bonded 2a, and at least a motor 52 constituting the feeder 50 is arranged on the side opposite to the side from which the tape 1 is conveyed, with respect to the center line A of the pressing portion 30 passing through the nip point B.SELECTED DRAWING: Figure 1 【課題】押圧部による被貼付面に対する押圧状態の安定性を高めることができるテープ貼付装置を提供すること。【解決手段】テープ１を押圧しながら被貼付面２ａに貼り付けるＡＴＬヘッド２０を備えたＡＴＬ装置１０であって、ＡＴＬヘッド２０が、テープ１を被貼付面２ａに押し付ける押圧部３０と、押圧部３０の押圧状態を調整するパラレルリンク機構４０と、押圧部３０と被貼付面２ａとのニップ点Ｂに向けてテープ１を搬送するフィーダー５０を含むテープ搬送部７０とを備え、少なくともフィーダー５０を構成するモータ５２が、ニップ点Ｂを通る押圧部３０の中心線Ａを挟んでテープ１が搬送されてくる側とは反対側に配置されている。【選択図】図１