CURABLE COMPOSITION, DRY FILM, CURED PRODUCT AND ELECTRONIC COMPONENT

To provide a curable composition which can achieve good solderability while containing a hydrophilic silica and a silicon-based surface conditioner, and which can solve the problem of agglomeration and precipitation of silica, a dry film, a cured product and an electronic component.SOLUTION: A curab...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: TAKAGI KOICHI, TOKAI HIROYUKI
Format: Patent
Sprache:eng ; jpn
Schlagworte:
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