CURABLE COMPOSITION, DRY FILM, CURED PRODUCT AND ELECTRONIC COMPONENT

To provide a curable composition which can achieve good solderability while containing a hydrophilic silica and a silicon-based surface conditioner, and which can solve the problem of agglomeration and precipitation of silica, a dry film, a cured product and an electronic component.SOLUTION: A curab...

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Hauptverfasser:	TAKAGI KOICHI, TOKAI HIROYUKI
Format:	Patent
Sprache:	eng ; jpn
Schlagworte:	APPARATUS SPECIALLY ADAPTED THEREFOR CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CINEMATOGRAPHY ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY ELECTROGRAPHY HOLOGRAPHY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS MATERIALS THEREFOR ORIGINALS THEREFOR PHOTOGRAPHY PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES PHYSICS PRINTED CIRCUITS
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Beschreibung
Zusammenfassung:	To provide a curable composition which can achieve good solderability while containing a hydrophilic silica and a silicon-based surface conditioner, and which can solve the problem of agglomeration and precipitation of silica, a dry film, a cured product and an electronic component.SOLUTION: A curable composition comprises (A) an alkali soluble resin, (B) a photoinitiator, (C) an epoxy resin, (D) a silicone compound, (E) a hydrophilic silica, and (F) an organic thixotropic agent. The curable composition can solve the problem of agglomeration and precipitation of hydrophilic silica in a curable composition. On condition that a substrate is coated with the curable composition, (D) the silicone compound keeps the wettability to the substrate, and concurrently, the wettability of flux to a resultant cured product is increased. Therefore, when the cured product is used as a solder resist, the effect of raising the solderability can be achieved.SELECTED DRAWING: None 【課題】親水性シリカ、シリコン系表面調整剤を含有しつつ、はんだ付け性が良好でシリカの凝集・沈殿の問題が解消された硬化性組成物、ドライフィルム、硬化物及び電子部品を提供すること【解決手段】（Ａ）アルカリ可溶性樹脂と、（Ｂ）光重合開始剤と、（Ｃ）エポキシ樹脂と、（Ｄ）シリコーン化合物と、（Ｅ）親水性シリカと、（Ｆ）有機揺変剤と、を含む硬化性組成物である。これにより、硬化性組成物内での親水性シリカの凝集・沈殿の問題が解消され、基材に硬化性組成物が塗布された場合に、（Ｄ）シリコーン化合物によって基材への濡れ性が維持され、同時に、得られた硬化物に対するフラックスのぬれ性が向上することから、硬化物がソルダーレジストとして使用された場合に、はんだ付け性の向上効果が得られる。【選択図】なし