SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING APPARATUS

To achieve complete prevention of pattern collapse while ensuring easy conveyance between processing units when executing drying after applying wet processing to a substrate formed with uneven patterns on a surface thereof.SOLUTION: The substrate processing method includes: a process of covering a surface of a substrate with a liquid film containing organic solvent after wet processing (step S104) is applied to the substrate formed with uneven patterns on the surface thereof at a first processing part and coagulating at least the neighbor of the surface of the liquid film to form a coagulation film (step S105); a process of conveying the substrate whose surface is covered with the coagulation film to a second processing part (steps S106, S107); and a process of supplying dissolution liquid to the coagulation film to dissolve the coagulation film, removing dissolution liquid from the surface of the substrate and drying the substrate at the second processing part (step S108).SELECTED DRAWING: Figure 5 【課題】表面に凹凸パターンが形成された基板に湿式処理を施した後乾燥させる際に、処理ユニット間での搬送の容易さを確保しながら、しかもパターン倒壊を確実に防止する。【解決手段】本発明に係る基板処理方法は、第１処理部で、表面に凹凸パターンが形成された基板に湿式処理（ステップＳ１０４）を施した後、基板の表面を有機溶剤を含む液膜で覆い、該液膜の少なくとも表面近傍を凝固させて凝固膜を形成する工程（ステップＳ１０５）と、凝固膜で表面が覆われた基板を第２処理部へ搬送する工程（ステップＳ１０６、Ｓ１０７）と、第２処理部で、凝固膜に対し溶解液を供給して凝固膜を溶解させ、基板の表面から溶解液を除去して基板を乾燥させる工程（ステップＳ１０８）とを備える。【選択図】図５