ELECTRONIC COMPONENT BUILT-IN CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF

To improve accuracy of image recognition performed when an electronic component is mounted on the surface of an isolating layer, by increasing contrast of an alignment mark.SOLUTION: An electronic component build-in circuit board 100 includes: a conductor layer L3 provided on a surface of an isolati...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	SUZUKI YOSHIHIRO, OKAWA HIROSHIGE, AOKI TAKURO
Format:	Patent
Sprache:	eng ; jpn
Schlagworte:	BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS SEMICONDUCTOR DEVICES
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