LIGHT EMITTING DEVICE MANUFACTURING METHOD AND SOLDER JOINT INSPECTION DEVICE

To provide a light-emitting device manufacturing method and a solder joint inspection device with which it is possible to suitably inspect the presence of a non-joined part and a void of a solder point.SOLUTION: In an inspection step, a threshold is set, an X-ray image of a solder point is acquired,...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	YAMADA SHUHEI, MINATO TATSUYA, KANEKO MASAYUKI, HONJO NORIAKI
Format:	Patent
Sprache:	eng ; jpn
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIRCHEMICAL OR PHYSICAL PROPERTIES MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS MEASURING PHYSICS PRINTED CIRCUITS TESTING
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