POWER SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SAME

To provide a power semiconductor device using a lead frame which facilitates mounting on a control board while suppressing deformation and bending of terminals and ensuring insulation between terminals, and to provide a method of manufacturing the same.SOLUTION: By providing a package 1, having a se...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	ICHIKAWA KEITARO, SHIKASHO YUJI, KAWAHARA FUMIHITO, KANO TAKETOSHI
Format:	Patent
Sprache:	eng ; jpn
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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