COMPOSITE FILLER AND RESIN COMPOSITION

To provide a composite filler which has high conductive efficiency and can be filled with a resin while activating high thermal conductivity of aluminum nitride powder.SOLUTION: A composite filler contains, when the total of the volume of the total constituent powder is taken as 100 vol.%: 60-90 vol...

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Bibliographische Detailangaben
Hauptverfasser: KURAMOTO AKIMASA, KANECHIKA YUKIHIRO
Format: Patent
Sprache:eng ; jpn
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Zusammenfassung:To provide a composite filler which has high conductive efficiency and can be filled with a resin while activating high thermal conductivity of aluminum nitride powder.SOLUTION: A composite filler contains, when the total of the volume of the total constituent powder is taken as 100 vol.%: 60-90 vol.% of aluminum nitride powder which is a polyhedral particle having a surface structure having at least two flat surfaces and has a cumulative 50% value (D50) in particle size distribution curve of 20-200 μm; and 10-40 vol.% of inorganic powder (B) which has thermal conductivity of 45-60 W/m K, Mohs hardness of 7 or less and a cumulative 50% value (D50) in particle size distribution curve of 2-20 μm.SELECTED DRAWING: None 【課題】窒化アルミニウム粉末の高い熱伝導性を活かしながら、伝導効率を高く樹脂充填が可能な複合フィラーを提供する。【解決手段】全構成粉末の体積の合計を100体積%として、少なくとも2面の平坦面を有する面構造を備えた多面体粒子であり、粒度 分布曲線における累積50%値(D50)が20μm〜200μmの窒化アルミニウム粉末(A)を60体積%〜90体積%と、熱伝導率が45W/m・K〜60W/m・K、モース硬度が7以下、粒度分布曲線における累積50%値(D50)が2μm〜20μmの無機粉末(B)を10体積%〜40体積%とを含有することを特徴とする複合フィラー。【選択図】なし