POWER STORAGE MODULE MANUFACTURING APPARATUS AND MANUFACTURING METHOD

To provide power storage module manufacturing apparatus and method that enable at least a part of a communication hole forming portion to be arranged in a communication hole in a short time.SOLUTION: A power storage module 4 includes an electrode laminate 11 and a seal member 12 that surrounds the e...

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1. Verfasser: KAWABATA YOSHIKATSU
Format: Patent
Sprache:eng ; jpn
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Zusammenfassung:To provide power storage module manufacturing apparatus and method that enable at least a part of a communication hole forming portion to be arranged in a communication hole in a short time.SOLUTION: A power storage module 4 includes an electrode laminate 11 and a seal member 12 that surrounds the electrode laminate 11. The seal member 12 includes a first resin seal 23 provided with a communication hole 23a communicating with an internal space V, and a second resin seal 24 provided with a communication hole 24a communicating with the communication hole 23a. The manufacturing apparatus 100 for the power storage module 4 includes a mold main body M for forming the second resin seal 24 by injection molding, and an insert die 52 which is attached to the mold main body M and has a communication hole forming portion 54 for forming the communication hole 24a, and a cam mechanism 60 for pressing out the insert die 52 to the first resin seal 23 while the electrode laminate 11 is arranged on the mold main body M so that at least a part of the communication hole forming portion 54 is arranged in the communication hole 23a.SELECTED DRAWING: Figure 19 【課題】連通孔形成部の少なくとも一部を連通孔内に短時間で配置できる蓄電モジュールの製造装置及び製造方法を提供する。【解決手段】蓄電モジュール4は、電極積層体11と、電極積層体11を取り囲むシール部材12とを備える。シール部材12は、内部空間Vと連通された連通孔23aが設けられた第1樹脂シール23と、連通孔23aと連通された連通孔24aが設けられた第2樹脂シール24とを備える。蓄電モジュール4の製造装置100は、第2樹脂シール24を射出成形により形成するための金型本体Mと、金型本体Mに取り付けられ、連通孔24aを形成するための連通孔形成部54を有する入れ子型52と、連通孔形成部54の少なくとも一部が連通孔23a内に配置されるように、金型本体Mに電極積層体11が配置された状態で、入れ子型52を第1樹脂シール23に向かって押し出すカム機構60とを備える。【選択図】図19