SEMICONDUCTOR CHIP, PIEZOELECTRIC DEVICE, AND ELECTRONIC APPARATUS
To provide a semiconductor chip that is not easily damaged in association with collision.SOLUTION: A semiconductor chip 50 has an electronic circuit surface 52 with bump electrodes 55 on the front side and has a back face 51 formed of a mirror surface on the back side. Since the semiconductor chip 5...
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| creator | HASHIMOTO AKIFUMI |
| description | To provide a semiconductor chip that is not easily damaged in association with collision.SOLUTION: A semiconductor chip 50 has an electronic circuit surface 52 with bump electrodes 55 on the front side and has a back face 51 formed of a mirror surface on the back side. Since the semiconductor chip 50 has the back face 51 formed of the mirror surface, even if a part of another piezoelectric device collides with the back face 51 of the semiconductor chip 50, due to the absence of a portion where concentration of stress occurs, damage to the semiconductor chip 50 can be prevented.SELECTED DRAWING: Figure 1
【課題】衝突に伴う損傷を生じにくい半導体チップを提供する【解決手段】半導体チップ５０は、表側にバンプ電極５５付きの電子回路面５２を有し、裏側に鏡面からなる裏面５１を有する。半導体チップ５０によれば、鏡面からなる裏面５１を有することにより、他の圧電デバイスの一部が半導体チップ５０の裏面５１に衝突しても応力集中を生じる部分が無いので、半導体チップ５０の損傷を抑制できる。【選択図】図１ |
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【課題】衝突に伴う損傷を生じにくい半導体チップを提供する【解決手段】半導体チップ５０は、表側にバンプ電極５５付きの電子回路面５２を有し、裏側に鏡面からなる裏面５１を有する。半導体チップ５０によれば、鏡面からなる裏面５１を有することにより、他の圧電デバイスの一部が半導体チップ５０の裏面５１に衝突しても応力集中を生じる部分が無いので、半導体チップ５０の損傷を抑制できる。【選択図】図１</description><language>eng ; jpn</language><subject>BASIC ELECTRIC ELEMENTS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; SEMICONDUCTOR DEVICES</subject><creationdate>2020</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20200831&DB=EPODOC&CC=JP&NR=2020136642A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,309,781,886,25568,76551</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20200831&DB=EPODOC&CC=JP&NR=2020136642A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>HASHIMOTO AKIFUMI</creatorcontrib><title>SEMICONDUCTOR CHIP, PIEZOELECTRIC DEVICE, AND ELECTRONIC APPARATUS</title><description>To provide a semiconductor chip that is not easily damaged in association with collision.SOLUTION: A semiconductor chip 50 has an electronic circuit surface 52 with bump electrodes 55 on the front side and has a back face 51 formed of a mirror surface on the back side. Since the semiconductor chip 50 has the back face 51 formed of the mirror surface, even if a part of another piezoelectric device collides with the back face 51 of the semiconductor chip 50, due to the absence of a portion where concentration of stress occurs, damage to the semiconductor chip 50 can be prevented.SELECTED DRAWING: Figure 1
【課題】衝突に伴う損傷を生じにくい半導体チップを提供する【解決手段】半導体チップ５０は、表側にバンプ電極５５付きの電子回路面５２を有し、裏側に鏡面からなる裏面５１を有する。半導体チップ５０によれば、鏡面からなる裏面５１を有することにより、他の圧電デバイスの一部が半導体チップ５０の裏面５１に衝突しても応力集中を生じる部分が無いので、半導体チップ５０の損傷を抑制できる。【選択図】図１</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>SEMICONDUCTOR DEVICES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2020</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZHAKdvX1dPb3cwl1DvEPUnD28AzQUQjwdI3yd_VxdQ4J8nRWcHEN83R21VFw9HNRgAj6-wGFHQMCHIMcQ0KDeRhY0xJzilN5oTQ3g5Kba4izh25qQX58anFBYnJqXmpJvFeAkYGRgaGxmZmJkaMxUYoAVu0rmg</recordid><startdate>20200831</startdate><enddate>20200831</enddate><creator>HASHIMOTO AKIFUMI</creator><scope>EVB</scope></search><sort><creationdate>20200831</creationdate><title>SEMICONDUCTOR CHIP, PIEZOELECTRIC DEVICE, AND ELECTRONIC APPARATUS</title><author>HASHIMOTO AKIFUMI</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_JP2020136642A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng ; jpn</language><creationdate>2020</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>SEMICONDUCTOR DEVICES</topic><toplevel>online_resources</toplevel><creatorcontrib>HASHIMOTO AKIFUMI</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>HASHIMOTO AKIFUMI</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>SEMICONDUCTOR CHIP, PIEZOELECTRIC DEVICE, AND ELECTRONIC APPARATUS</title><date>2020-08-31</date><risdate>2020</risdate><abstract>To provide a semiconductor chip that is not easily damaged in association with collision.SOLUTION: A semiconductor chip 50 has an electronic circuit surface 52 with bump electrodes 55 on the front side and has a back face 51 formed of a mirror surface on the back side. Since the semiconductor chip 50 has the back face 51 formed of the mirror surface, even if a part of another piezoelectric device collides with the back face 51 of the semiconductor chip 50, due to the absence of a portion where concentration of stress occurs, damage to the semiconductor chip 50 can be prevented.SELECTED DRAWING: Figure 1
【課題】衝突に伴う損傷を生じにくい半導体チップを提供する【解決手段】半導体チップ５０は、表側にバンプ電極５５付きの電子回路面５２を有し、裏側に鏡面からなる裏面５１を有する。半導体チップ５０によれば、鏡面からなる裏面５１を有することにより、他の圧電デバイスの一部が半導体チップ５０の裏面５１に衝突しても応力集中を生じる部分が無いので、半導体チップ５０の損傷を抑制できる。【選択図】図１</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES |
| title | SEMICONDUCTOR CHIP, PIEZOELECTRIC DEVICE, AND ELECTRONIC APPARATUS |
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