SEMICONDUCTOR CHIP, PIEZOELECTRIC DEVICE, AND ELECTRONIC APPARATUS

To provide a semiconductor chip that is not easily damaged in association with collision.SOLUTION: A semiconductor chip 50 has an electronic circuit surface 52 with bump electrodes 55 on the front side and has a back face 51 formed of a mirror surface on the back side. Since the semiconductor chip 50 has the back face 51 formed of the mirror surface, even if a part of another piezoelectric device collides with the back face 51 of the semiconductor chip 50, due to the absence of a portion where concentration of stress occurs, damage to the semiconductor chip 50 can be prevented.SELECTED DRAWING: Figure 1 【課題】衝突に伴う損傷を生じにくい半導体チップを提供する【解決手段】半導体チップ５０は、表側にバンプ電極５５付きの電子回路面５２を有し、裏側に鏡面からなる裏面５１を有する。半導体チップ５０によれば、鏡面からなる裏面５１を有することにより、他の圧電デバイスの一部が半導体チップ５０の裏面５１に衝突しても応力集中を生じる部分が無いので、半導体チップ５０の損傷を抑制できる。【選択図】図１