MANUFACTURING METHOD OF MULTILAYER ELECTRONIC COMPONENT

To provide a manufacturing method of a multilayer electronic component, in which a print position deviation is hardly generated in a conductive body part, and a sheet attack is hardly generated in a functional part.SOLUTION: A manufacturing method of a multilayer electronic component, having an elem...

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Hauptverfasser:	KOIDE NOBUYUKI, KAJIYAMA SHOHEI
Format:	Patent
Sprache:	eng ; jpn
Schlagworte:	BASIC ELECTRIC ELEMENTS CAPACITORS CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES ORLIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE ELECTRICITY
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Zusammenfassung:	To provide a manufacturing method of a multilayer electronic component, in which a print position deviation is hardly generated in a conductive body part, and a sheet attack is hardly generated in a functional part.SOLUTION: A manufacturing method of a multilayer electronic component, having an element main body in which a functional part and a conductive body part are laminated, includes: a step of forming a green conductive main body by printing a first paste at least containing a conductive body particle and a solvent onto a support film by an offset printing or a flexographic printing; and a step of transferring the green conductive body part onto a green functional part from the support film. A front surface adhesion energy of the support film is 2 mJ/mor more and 8 mJ/mor less.SELECTED DRAWING: Figure 2C 【課題】導電体部の印刷位置ズレが生じにくく、かつ機能部へのシートアタックが生じにくい積層電子部品の製造方法を提供すること。【解決手段】機能部と導電体部とが積層された素子本体を有する積層電子部品の製造方法であって、オフセット印刷またはフレキソ印刷により、少なくとも導電体粒子と溶剤とを含む第１のペーストを支持フィルム上に印刷して、グリーン導電体部を形成する工程と、支持フィルムから、グリーン導電体部をグリーン機能部上に転写する工程と、を有し、支持フィルムの表面付着エネルギーが２ｍＪ／ｍ２以上８ｍＪ／ｍ２以下である積層電子部品の製造方法である。【選択図】図２Ｃ