LIQUID EPOXY RESIN COMPOSITION AND CURED PRODUCT OBTAINED BY CURING THE SAME

To provide a liquid epoxy resin composition which is liquid having a low viscosity at normal temperature and exhibits sufficient adhesive strength and provides a cured product exhibiting a relative permittivity and dielectric dissipation factor lower than conventional one.SOLUTION: There is provided a liquid epoxy resin composition which comprises (A) a first epoxy resin, (B) a second epoxy resin and (C) a curing agent capable of curing an epoxy resin and (D) a filler in a specific composition.EFFECT: The liquid epoxy resin composition is liquid having a low viscosity at normal temperature and exhibits sufficient adhesive strength to fix an electronic component to a substrate. A cured product obtained by curing the liquid epoxy resin composition exhibits a relative permittivity and dielectric dissipation factor lower than a cured product provided by conventional one. Thus, an electronic component, which includes more micronized wiring and can correspond to processing of a higher frequency signal, can be easily prepared and the electronic component can be mounted on a substrate with sufficient adhesive strength.SELECTED DRAWING: Figure 1 【課題】常温では低粘度の液体であり、かつ十分な接着強度を示すと共に、従来品に比して低い比誘電率及び誘電正接を示す硬化物を与える液状エポキシ樹脂組成物及びそれを硬化させて得られる硬化物等を提供する。【解決手段】（Ａ）第１のエポキシ樹脂、（Ｂ）第２のエポキシ樹脂、（Ｃ）エポキシ樹脂を硬化させることができる硬化剤及び（Ｄ）充填剤、を特定の組成で含む液状エポキシ樹脂組成物。【効果】該液状エポキシ樹脂組成物は、常温では低粘度の液体であり、かつ電子部品を基板に固定するのに十分な接着強度を示す。該液状エポキシ樹脂組成物を硬化させて得られる硬化物は、従来品が与える硬化物に比して低い比誘電率及び誘電正接を示す。従って、より微細化された配線を含み、より高周波の信号を処理することに対応し得る電子部品を容易に作成することができ、またこの電子部品を、十分な接着強度をもって基板に実装することができる。【選択図】図１