PHOTOSENSITIVE ADHESIVE COMPOSITION AND SEMICONDUCTOR DEVICE

To provide a photosensitive adhesive composition which is used as an adhesive layer bonding semiconductor elements, and thereby reduces occurrence of air bubbles (voids) on an interface between a semiconductor element and an adhesive layer or can remove the air bubbles, and as a result, can enhance...

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Bibliographische Detailangaben
Hauptverfasser:	HORII MAKOTO, HASHIMOTO KAZUMI, SUGIYAMA HIROMICHI
Format:	Patent
Sprache:	eng ; jpn
Schlagworte:	ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES APPARATUS SPECIALLY ADAPTED THEREFOR CHEMISTRY CINEMATOGRAPHY DYES ELECTROGRAPHY HOLOGRAPHY MATERIALS THEREFOR METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL ORIGINALS THEREFOR PAINTS PHOTOGRAPHY PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES PHYSICS POLISHES USE OF MATERIALS AS ADHESIVES
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Beschreibung
Zusammenfassung:	To provide a photosensitive adhesive composition which is used as an adhesive layer bonding semiconductor elements, and thereby reduces occurrence of air bubbles (voids) on an interface between a semiconductor element and an adhesive layer or can remove the air bubbles, and as a result, can enhance adhesiveness (adhesion) between the semiconductor elements; and a semiconductor device that is provided with a laminate type semiconductor element bonding the semiconductor elements by a cured product of the photosensitive adhesive composition and has high reliability.SOLUTION: A photosensitive adhesive composition contains (A) an alkali-soluble resin, (B) a photoacid generator, (C) an epoxy compound and (D) a phenol compound having a melting point of 50-150°C.SELECTED DRAWING: None 【課題】半導体素子同士を接着する接着層として用いることで、半導体素子と接着層との界面に気泡（ボイド）が発生することを低減する、または気泡を除去することができ、その結果、半導体素子同士の接着性（密着性）を高めることができる感光性接着剤組成物、および、かかる感光性接着剤組成物の硬化物により半導体素子同士を接着した積層型半導体素子を備えた信頼性の高い半導体装置の提供。【解決手段】（Ａ）アルカリ可溶性樹脂と、（Ｂ）光酸発生剤と、（Ｃ）エポキシ化合物と、（Ｄ）融点が５０〜１５０℃であるフェノール化合物と、を含むことを特徴とする感光性接着剤組成物。【選択図】なし