ADHESIVE COMPOSITION FOR TEMPORARY BONDING, AND METHOD FOR MANUFACTURING SEMICONDUCTOR ELECTRONIC COMPONENT USING THE SAME

To provide an adhesive composition for temporary bonding which is capable of passing through a manufacturing process of a semiconductor electronic component, the process including a heat treatment of 300°C or higher in a state where a semiconductor electronic circuit forming substrate and a supporti...

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Hauptverfasser:	ARIMOTO SHINJI, OKAZAWA TORU
Format:	Patent
Sprache:	eng ; jpn
Schlagworte:	ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES BASIC ELECTRIC ELEMENTS CHEMISTRY COMPOSITIONS BASED THEREON DYES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY LAYERED PRODUCTS LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL ORGANIC MACROMOLECULAR COMPOUNDS PAINTS PERFORMING OPERATIONS POLISHES SEMICONDUCTOR DEVICES THEIR PREPARATION OR CHEMICAL WORKING-UP TRANSPORTING USE OF MATERIALS AS ADHESIVES
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Beschreibung
Zusammenfassung:	To provide an adhesive composition for temporary bonding which is capable of passing through a manufacturing process of a semiconductor electronic component, the process including a heat treatment of 300°C or higher in a state where a semiconductor electronic circuit forming substrate and a supporting substrate are bonded, and which is capable of being solvent-stripped by a volatile solvent.SOLUTION: There is provided an adhesive composition for temporary bonding comprising at least: (A) a polyimide resin having a tetracarboxylic anhydride residue and a diamine residue or a precursor thereof, wherein the diamine residue has 50 to 100 mol% of a polysiloxane diamine residue represented by general formula (1) in all diamine residues and the polyimide resin or the precursor thereof has a dicarboxylic anhydride residue represented by general formula (2) and/or a monoamine residue represented by general formula (3) at a terminal; and (B) a solvent.SELECTED DRAWING: None 【課題】半導体電子回路形成基板と支持基板を接着した状態で、３００℃以上の熱処理を有する半導体電子部品の製造工程を通過でき、その後、揮発性溶剤で溶剤剥離することが可能な仮貼り用接着剤組成物を提供する。【解決手段】少なくとも、（Ａ）テトラカルボン酸無水物残基とジアミン残基を有するポリイミド樹脂またはその前躯体であって、該ジアミン残基が一般式（１）で表されるポリシロキサン系ジアミン残基を全ジアミン残基中５０〜１００モル％有し、且つ一般式（２）で表されるジカルボン酸無水物残基および／または一般式（３）で表されるモノアミン残基を末端に有するポリイミド樹脂またはその前躯体、および（Ｂ）溶媒を含有する仮貼り用接着剤組成物。【選択図】なし