HEAT MANAGEMENT SYSTEM

To provide a heat management system in which deterioration of a flow path forming portion can be suppressed.SOLUTION: A heat management system 10 managing heat of a heat generating element 12 generating heat as a result of discharge and charge or power conversion, comprises: a liquid heat transport...

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Bibliographische Detailangaben
Hauptverfasser: ISHIHARA YASUO, MIYAJI HARUHIKO, KAJIKAWA SHUNJI, NAKAJIMA SAORI, FUSE TAKUYA, ASANO KOJI
Format: Patent
Sprache:eng ; jpn
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Zusammenfassung:To provide a heat management system in which deterioration of a flow path forming portion can be suppressed.SOLUTION: A heat management system 10 managing heat of a heat generating element 12 generating heat as a result of discharge and charge or power conversion, comprises: a liquid heat transport medium 14 transporting heat received from the heat generating element 12; and a circuit 20 through which the heat transport medium 14 flows. The heat transport medium 14 includes: a liquid base material; and an Si compound represented by Formula (I) and the like. R- Rin Formula (I) are the same or different from each other and represent oxygen-free groups that are directly bonded to Si in the formula. Z in Formula (I) represents a group including oxygen that is directly bonded to Si in the formula.SELECTED DRAWING: Figure 1 【課題】流路形成部の劣化を抑制することができる熱マネジメントシステムを提供する。【解決手段】放充電または電力変換に伴って発熱する発熱体12の熱を管理する熱マネジメントシステム10は、発熱体12から受けた熱を輸送する液状の熱輸送媒体14と、熱輸送媒体14が流れる回路20とを備える。熱輸送媒体14は、液状の基材と、式(I)等で示されるSi化合物とを含む。式(I)中のR1〜R3は、互いに同じまたは異なり、式中のSiと直接結合する酸素を含まない基を表す。式(I)中のZは、式中のSiと直接結合する酸素を含む基を表す。【選択図】図1