CURABLE RESIN COMPOSITION, DRY FILM, CURED PRODUCT, AND ELECTRONIC COMPONENT

To provide a curable resin composition that is excellent in developability, dry control width, and sensitivity, and is also excellent in heat resistance and bendability after curing.SOLUTION: A curable resin composition contains (A) an alkali-soluble resin, (B) a polyglycerol (meth) acrylate, and (C...

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Hauptverfasser:	FUKUDA SHINICHIRO, MAKITA SHOHEI, SHIINA MOMOKO, CHA HANEUL
Format:	Patent
Sprache:	eng ; jpn
Schlagworte:	APPARATUS SPECIALLY ADAPTED THEREFOR CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHEMISTRY CINEMATOGRAPHY COMPOSITIONS BASED THEREON ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY ELECTROGRAPHY HOLOGRAPHY MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVINGCARBON-TO-CARBON UNSATURATED BONDS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS MATERIALS THEREFOR METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS ORIGINALS THEREFOR PHOTOGRAPHY PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES PHYSICS PRINTED CIRCUITS THEIR PREPARATION OR CHEMICAL WORKING-UP
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Beschreibung
Zusammenfassung:	To provide a curable resin composition that is excellent in developability, dry control width, and sensitivity, and is also excellent in heat resistance and bendability after curing.SOLUTION: A curable resin composition contains (A) an alkali-soluble resin, (B) a polyglycerol (meth) acrylate, and (C) a photopolymerization initiator.SELECTED DRAWING: None 【課題】現像性、乾燥管理幅及び感度に優れ、硬化後の耐熱性及び折り曲げ性にも優れる硬化性樹脂組成物を提供すること。【解決手段】（Ａ）アルカリ可溶性樹脂、（Ｂ）ポリグリセリン系（メタ）アクリレート、（Ｃ）光重合開始剤、及びを含む硬化性樹脂組成物。【選択図】なし