METHOD OF MANUFACTURING SUSPENSION BOARD WITH CIRCUIT AND SUSPENSION BOARD ASSEMBLY WITH CIRCUIT

To provide a method for manufacturing a suspension board with a circuit and a suspension board assembly with a circuit capable of inspecting a formation failure of a first insulating layer and/or a second insulating layer.SOLUTION: After forming an insulating base layer 9 on one surface in a thickne...

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1. Verfasser: FUJIMURA HIROTO
Format: Patent
Sprache:eng ; jpn
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Zusammenfassung:To provide a method for manufacturing a suspension board with a circuit and a suspension board assembly with a circuit capable of inspecting a formation failure of a first insulating layer and/or a second insulating layer.SOLUTION: After forming an insulating base layer 9 on one surface in a thickness direction of a metal supporting layer 12, a conductive pattern 10 is formed on one surface in the thickness direction of the insulating base layer 9, and then a cover insulating layer 11 is formed on one side in the thickness direction of the insulating base layer 9. Then, in an inspection section 4, an inspection insulating layer is formed on one surface in the thickness direction of the metal supporting layer 12 by the same step as the formation of the insulating base layer 9 and/or the cover insulating layer 11, and a first insulating layer inspection probe is brought into contact with the inspection insulating layer to inspect conduction with the metal supporting layer 12.SELECTED DRAWING: Figure 2 【課題】第1絶縁層および/または第2絶縁層の形成不良を検査することができる回路付サスペンション基板の製造方法および回路付サスペンション基板集合体を提供する。【解決手段】金属支持層12の厚み方向一方面にベース絶縁層9を形成した後、ベース絶縁層9の厚み方向一方面に導体パターン10を形成し、次いで、ベース絶縁層9の厚み方向一方側にカバー絶縁層11を形成する。そして検査部4に、ベース絶縁層9および/またはカバー絶縁層11の形成と同一工程により、金属支持層12の厚み方向一方面に検査絶縁層を形成し、検査絶縁層に第1絶縁層検査プローブを接触させて、金属支持層12との導通を検査する。【選択図】図2