WIRING BOARD AND ELECTRONIC APPARATUS

To provide a wiring board having a resistor formed thereon capable of handling an ultrahigh frequency area while improving the frequency characteristic.SOLUTION: The wiring board includes a resistance part provided on a surface of a base material, and a wiring part connected to the resistance part....

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Bibliographische Detailangaben
1. Verfasser:	ISHIBASHI DAIJIRO
Format:	Patent
Sprache:	eng ; jpn
Schlagworte:	BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:	To provide a wiring board having a resistor formed thereon capable of handling an ultrahigh frequency area while improving the frequency characteristic.SOLUTION: The wiring board includes a resistance part provided on a surface of a base material, and a wiring part connected to the resistance part. The resistance part has a first metal film provided on the surface of the base material, and an oxidation part formed of a metal oxide constituting the first metal film, which is partially provided in the first metal film.SELECTED DRAWING: Figure 1C 【課題】配線基板に形成される抵抗体において、周波数特性を改善し、超高周波領域への対応を可能とする。【解決手段】配線基板は、基材の表面に設けられた抵抗部と、抵抗部に接続された配線部とを含む。抵抗部は、基材の表面に設けられた第１の金属膜と、第１の金属膜内に部分的に設けられ、第１の金属膜を構成する金属の酸化物からなる酸化部と、を有する。【選択図】図１Ｃ