MEASURING METHOD OF LIQUID COMPONENT ON SUBSTRATE, AND SUBSTRATE PROCESSING APPARATUS

To provide a measuring method of a liquid component on a substrate capable of measuring on the spot, the amount of a component existing on the substrate, while processing the substrate.SOLUTION: In a measuring method of a liquid component on a substrate, process liquid S is supplied onto a rotating...

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Bibliographische Detailangaben
Hauptverfasser:	YASUDA NOBUYOSHI, HIRAKI SATORU, YOKOTA HIROSHI
Format:	Patent
Sprache:	eng ; jpn
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIRCHEMICAL OR PHYSICAL PROPERTIES MEASURING PHYSICS SEMICONDUCTOR DEVICES TESTING
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Beschreibung
Zusammenfassung:	To provide a measuring method of a liquid component on a substrate capable of measuring on the spot, the amount of a component existing on the substrate, while processing the substrate.SOLUTION: In a measuring method of a liquid component on a substrate, process liquid S is supplied onto a rotating substrate W, and an infrared ray IR is irradiated to a liquid film F of the process liquid formed on the substrate upper surface during supply of the process liquid and/or after supply stop, and reflected light is received, and a present amount of one or more components contained in the process liquid film is measured from absorbance at a prescribed wavelength.SELECTED DRAWING: Figure 1 【課題】基板を処理しながら、基板上に存在する成分の量をその場で測定可能な基板上の液体成分の測定方法を提供する。【解決手段】回転する基板Ｗ上に処理液Ｓを供給し、前記処理液の供給中および／または供給停止後に、前記基板上面に形成された前記処理液の液膜Ｆに赤外線ＩＲを照射して反射光を受光し、所定波長における吸光度から前記処理液膜に含まれる１以上の成分の存在量を測定する、基板上の液体成分の測定方法である。【選択図】図１