RESIN MOLDING DEVICE, AND METHOD FOR MANUFACTURING RESIN MOLDING

To maintain flatness of a molding die irrespective of deformation of a platen.SOLUTION: A resin molding device includes molding dies 2 and 3, platens 41 and 42 on which the molding dies 2 and 3 are molded, a plurality of first transmission members 5 which are provided on the molding dies 2 and 3, an...

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Hauptverfasser: TANIGUCHI SHOICHI, NORIKANE KAZUTAKA, ARAKI KOSUKE, NISHIHIRA TAKANORI, TAKAI YASUMASA
Format: Patent
Sprache:eng ; jpn
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Zusammenfassung:To maintain flatness of a molding die irrespective of deformation of a platen.SOLUTION: A resin molding device includes molding dies 2 and 3, platens 41 and 42 on which the molding dies 2 and 3 are molded, a plurality of first transmission members 5 which are provided on the molding dies 2 and 3, and a plurality of second transmission members 6 which are provided corresponding to the plurality of first transmission members 5 in the platens 41 and 42, in which the first transmission member 5 and the second transmission member 5 transmit a mold closing force from the platens 41 and 42 to the molding dies 2 and 3, and contact surfaces 5a and 6a of the first transmission member 5 and the second transmission member 6 are planes.SELECTED DRAWING: Figure 1 【課題】プラテンの変形に関わらず、成形型の平坦度を維持する。【解決手段】成形型2、3と、成形型2、3が取り付けられるプラテン41、42と、成形型2、3に設けられた複数の第1伝達部材5と、プラテン41、42において複数の第1伝達部材5に対応して設けられた複数の第2伝達部材6とを備え、第1伝達部材5及び第2伝達部材5は、プラテン41、42からの型締め力を成形型2、3に伝達するものであり、第1伝達部材5及び第2伝達部材6同士の接触面5a、6aは平面状をなすものである。【選択図】図1