CONDUCTIVE PASTE COMPOSITION AND SEMICONDUCTOR DEVICES MADE THEREWITH
To permit formation of narrow, high aspect ratio features in a conductive structure.SOLUTION: A paste composition comprises: (a) a source of electrically conductive metal; (b) a glass frit of 0.25-8 wt.% based on the total weight of the conductive paste; and (c) an organic vehicle in which the sourc...
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Zusammenfassung: | To permit formation of narrow, high aspect ratio features in a conductive structure.SOLUTION: A paste composition comprises: (a) a source of electrically conductive metal; (b) a glass frit of 0.25-8 wt.% based on the total weight of the conductive paste; and (c) an organic vehicle in which the source of electrically conductive metal and the glass frit are dispersed, the organic vehicle comprising organic polymer material and a solvent, where the organic polymer material comprises microgel particles having polymer units with molecular weights ranging from 107 to 1012 and optionally one or more additional polymeric materials, with the total amount of the organic polymer material ranging from 0.01 to 5 wt.% based on the total weight of the paste composition.SELECTED DRAWING: Figure 1F
【課題】導電性構造物内に細い高アスペクト比の特徴を形成することを可能にする。【解決手段】ペースト組成物であって、(a)電気導電性金属の供給源と、(b)前記ペースト組成物の全重量に基いて0.25〜8重量%のガラスフリットと、(c)有機ビヒクルと、を含み、前記有機ビヒクルの中に前記電気導電性金属の供給源と前記ガラスフリットとが分散され、前記有機ビヒクルが有機ポリマー材料と溶媒とを含み、前記有機ポリマー材料が、107〜1012の範囲の分子量を有するポリマー単位を有するミクロゲル粒子と、任意選択で、1つまたは複数の追加のポリマー材料を含み、前記有機ポリマー材料の全量が、前記ペースト組成物の全重量に基いて、0.01〜5重量%である、ペースト組成物である。【選択図】図1F |
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