CIRCUIT SUBSTRATE CONFIGURATION BODY

To provide a circuit substrate configuration body exhibiting a heat dissipation property while saving space.SOLUTION: There are provided: a heat sink 40; a substrate 50 provided on the heat sink 40; a connection metal body 60 thermally connected with the heat sink 40 that is mounted on the substrate...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	HOTTA YUKI, MASE TOMOYUKI
Format:	Patent
Sprache:	eng ; jpn
Schlagworte:	APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC,OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWERSUPPLY SYSTEMS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CONTROL OR REGULATION THEREOF CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUTPOWER CONVERSION OR DISTRIBUTION OF ELECTRIC POWER ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY GENERATION MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS
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