METHOD FOR MANUFACTURING PRINTED WIRING BOARD WITH ELECTROMAGNETIC WAVE SHIELDING FILM

To provide a method for manufacturing a printed wiring board with an electromagnetic wave shielding film that can manufacture a printed wiring board with an electromagnetic shielding film that has excellent flame retardancy for a conductive adhesive layer of the electromagnetic shielding film, and is difficult for an adhesive component to elute from the conductive adhesive layer when the printed wiring board with an insulating film and the electromagnetic wave shielding film are hot-pressed.SOLUTION: The thickness of a conductive adhesive layer (anisotropic conductive adhesive layer 24) is 0.5 μm or more and 30 μm or less, an adhesive component of the conductive adhesive layer includes an adhesive resin and a flame retardant, and the content of the flame retardant in the adhesive component is 100 parts by mass or more and 1 part by mass or more for 1000 parts by mass or less of the adhesive resin, the melting point at 1 atm of the flame retardant is 25°C or more, and the temperature T of the hot-press and the melting point Tm at 1 atm of the flame retardant satisfies the relationship of T-Tm