ELECTRONIC DEVICE AND HOUSING UNIT FOR ELECTRONIC DEVICE

To suppress turbulence in convection to facilitate the convection, thereby improving cooling efficiency for a heat generating body.SOLUTION: In an electronic device 10, a board 22 is disposed along a vertical direction. A heat generating body 20 is mounted on a first surface 22A of the board 22, and a first thermally conductive member 32 is superposed on a second surface 22B opposite the first surface 22A of the board 22. A plurality of second thermally conductive members 34 extend in a horizontal direction from a first surface 32A of the first thermally conductive member 32. Distal end portions 34A of the plurality of second thermally conductive members 34 are positioned on a side opposite the board 22 relative to the heat generating body 20. A third thermally conductive member 36 faces the first surface 22A of the board 22, and is secured to the distal end portions 34A of the plurality of second thermally conductive members 34. A housing 16 includes a first wall portion 44 superposed on a second surface 32B of the first thermally conductive member 32 and a second wall portion 46 opposite the first wall portion 44. A heat radiator 18 is provided on an outer surface of the second wall portion 46.SELECTED DRAWING: Figure 3 【課題】対流の乱れを抑制することで対流を促進させて発熱体の冷却効率を向上させる。【解決手段】電子機器１０において、基板２２は、鉛直方向に沿って配置される。基板２２の第一面２２Ａには、発熱体２０が実装され、第一熱伝導部材３２は、基板２２の第一面２２Ａとは反対側の第二面２２Ｂに重ね合わされている。複数の第二熱伝導部材３４は、第一熱伝導部材２２の第一面２２Ａから水平方向に延びている。複数の第二熱伝導部材３４の先端部３４Ａは、発熱体２０に対する基板２２と反対側に位置する。第三熱伝導部材３６は、基板２２の第一面２２Ａと対向し、複数の第二熱伝導部材３４の先端部３４Ａに固定されている。筐体１６は、第一熱伝導部材３２の第二面３２Ｂと重ね合わされた第一壁部４４と、第一壁部４４と反対側の第二壁部４６とを有する。放熱器１８は、第二壁部４６の外側の面に設けられている。【選択図】図３