PHOTOCURABLE RESIN COMPOSITION

To provide a photocurable resin composition which enables a photocurable resin to be extruded from a nozzle by a simple FDM method without involving a support material, to be cured by light radiation, and to be laminated and molded in a short time.SOLUTION: There is provided a photocurable resin com...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: ISHIMARU YUYA, KIYOSADA SHUNJI, KUNIHIRO YOSHIRO
Format: Patent
Sprache:eng ; jpn
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Beschreibung
Zusammenfassung:To provide a photocurable resin composition which enables a photocurable resin to be extruded from a nozzle by a simple FDM method without involving a support material, to be cured by light radiation, and to be laminated and molded in a short time.SOLUTION: There is provided a photocurable resin composition comprising: 20-100 mass% of an urethane prepolymer having one or more maleimide groups as an unsaturated group; a viscosity at 20°C of 0.2 Pa s or greater; and a viscosity at 150°C of 1000 Pa s or smaller.SELECTED DRAWING: None 【課題】サポート材を必要とせず、簡便なFDM方式により光硬化性樹脂をノズルから押出しながら、光照射により硬化させ、短時間に積層して造形できる光硬化性樹脂組成物を提供することを課題とする。【解決手段】不飽和基としてマレイミド基を一つ以上有するウレタンプレポリマーを20〜100質量%を含有する、20℃における粘度が0.2Pa・s以上、且つ、150℃における粘度が1000Pa・s以下である光硬化性樹脂組成物を見出した。【選択図】なし