WIRING FORMATION METHOD

To suppress the dripping of a conductive paste applied to an inclined surface of a three-dimensional structure.SOLUTION: A wiring formation method for forming wirings 3a and 3b on the surface of a three-dimensional structure 2 having an inclined surface 2c includes the steps of: forming trenches 2a...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	MATSUURA TSUKASA, GOTO AKIHITO
Format:	Patent
Sprache:	eng ; jpn
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!