PHOTOSENSITIVE RESIN COMPOSITION, CURED FILM, LAMINATE, METHOD FOR PRODUCING CURED FILM, METHOD FOR PRODUCING LAMINATE, AND SEMICONDUCTOR DEVICE

To provide: a photosensitive resin composition which allows ring closure to be made with a high ring closure rate even at a low temperature and which can be cured to form a cured film having a high glass transition temperature; and a cured film, a laminate, a method for producing the cured film, a method for producing the laminate, and a semiconductor device in which the photosensitive resin composition is used.SOLUTION: The photosensitive resin composition includes a heterocyclic ring-containing polymer precursor, a thermal-base generator, and an organic compound containing a Group 4 element. The heterocyclic ring-containing polymer precursor is a polyimide precursor or a polybenzoxazole precursor. The polyimide precursor comprises repeating units represented by the formula in the figure, which account for more than 90 mol% of all repeating units of the polyimide precursor.SELECTED DRAWING: Figure 1 【課題】低温でも高い閉環率で閉環が可能な感光性樹脂組成物であって、硬化して得られる硬化膜のガラス転移温度が高い感光性樹脂組成物、ならびに、感光性樹脂組成物を用いた、硬化膜、積層体、硬化膜の製造方法、積層体の製造方法および半導体デバイスを提供する。【解決手段】複素環含有ポリマー前駆体と、熱塩基発生剤と、第４族元素を含む有機化合物を含み、複素環含有ポリマー前駆体が、ポリイミド前駆体またはポリベンゾオキサゾール前駆体であり、ポリイミド前駆体が、下記式で表される繰り返し単位を含み、ポリイミド前駆体の全繰り返し単位の９０モル％超が下記式で表される繰り返し単位である感光性樹脂組成物。【選択図】図１