CONDUCTIVE PARTICLE WITH INSULATING PART, METHOD FOR PRODUCING CONDUCTIVE PARTICLE WITH INSULATING PART, CONDUCTIVE MATERIAL AND CONNECTION STRUCTURE

To provide conductive particles with insulating part which can effectively enhance conductive reliability and insulating reliability even when vibration and impact are applied thereto from the outside.SOLUTION: Conductive particles with insulating part include conductive particles having a conductiv...

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1. Verfasser: SUGIMOTO OSAMU
Format: Patent
Sprache:eng ; jpn
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Zusammenfassung:To provide conductive particles with insulating part which can effectively enhance conductive reliability and insulating reliability even when vibration and impact are applied thereto from the outside.SOLUTION: Conductive particles with insulating part include conductive particles having a conductive part on at least its surface, and an insulating part arranged on the surface of the conductive particles, in which the insulating part is a polymer of a polymerizable component containing a plurality of kinds of polymerizable compounds, the polymerizable component contains a polymerizable compound having a first reactive functional group and a polymerizable compound having a second reactive functional group different from the first reactive functional group, the polymerizable component contains no crosslinking agent, the polymerizable component contains 10 wt.% or more of a polymerizable compound having a glass transition temperature of a homopolymer of lower than 100°C in 100 wt.% of the polymerizable component, and the polymer has the first reactive functional group and the second reactive functional group.SELECTED DRAWING: Figure 1 【課題】外部から振動や衝撃が付与された場合でも、導通信頼性及び絶縁信頼性を効果的に高めることができる絶縁部付き導電性粒子を提供する。【解決手段】本発明に係る絶縁部付き導電性粒子は、導電部を少なくとも表面に有する導電性粒子と、前記導電性粒子の表面上に配置された絶縁部とを備え、前記絶縁部が、複数種の重合性化合物を含む重合性成分の重合体であり、前記重合性成分が、第1の反応性官能基を有する重合性化合物と、前記第1の反応性官能基とは異なる第2の反応性官能基を有する重合性化合物とを含み、前記重合性成分が、架橋剤を含まず、かつ、前記重合性成分が、該重合性成分100重量%中に、単独重合体のガラス転移温度が100℃未満である重合性化合物を10重量%以上含み、前記重合体が、前記第1の反応性官能基と前記第2の反応性官能基とを有する。【選択図】図1