ACID GROUP-CONTAINING (METH)ACRYLATE RESIN, CURABLE RESIN COMPOSITION, CURED PRODUCT, INSULATING MATERIAL, RESIN MATERIAL FOR SOLDER RESIST, AND RESIST MEMBER

To provide an acid group-containing (meth)acrylate resin giving a cured product excellent in heat resistance and elongation, a curable resin composition containing the same, and an insulating material, a resin material for a solder resist, and a resist member comprising the curable resin composition...

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Bibliographische Detailangaben
Hauptverfasser:	YAMADA SHUNSUKE, KAMEYAMA YASUSHI
Format:	Patent
Sprache:	eng ; jpn
Schlagworte:	CHEMISTRY COMPOSITIONS BASED THEREON MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVINGCARBON-TO-CARBON UNSATURATED BONDS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-UP
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Beschreibung
Zusammenfassung:	To provide an acid group-containing (meth)acrylate resin giving a cured product excellent in heat resistance and elongation, a curable resin composition containing the same, and an insulating material, a resin material for a solder resist, and a resist member comprising the curable resin composition.SOLUTION: The acid group-containing (meth)acrylate resin is used which uses an amide-imide resin (A) having an acid group and/or an acid anhydride group, a hydroxyl group-containing (meth)acrylate compound (B), an epoxy resin (C), an unsaturated monobasic acid (D), and a polycarboxylic acid anhydride (E) as essential reaction raw materials.SELECTED DRAWING: None 【課題】硬化物における耐熱性及び伸度に優れた酸基含有（メタ）アクリレート樹脂、これを含有する硬化性樹脂組成物、前記硬化性樹脂組成物からなる絶縁材料、ソルダーレジスト用樹脂材料及びレジスト部材を提供する。【解決手段】酸基及び／または酸無水物基を有するアミドイミド樹脂（Ａ）、水酸基含有（メタ）アクリレート化合物（Ｂ）、エポキシ樹脂（Ｃ）、不飽和一塩基酸（Ｄ）及びポリカルボン酸無水物（Ｅ）を必須の反応原料とすることを特徴とする酸基含有（メタ）アクリレート樹脂を用いる。【選択図】なし