CERAMIC WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME

To provide a ceramic wiring board which can suppress the formation of a defect in a wiring line even in the case of a wiring line with a small Ni content and a method for manufacturing such a ceramic wiring board.SOLUTION: In a ceramic wiring board 1, a via-hole conducting portion 7 and a surface conducting portion 9 contain Mo as a conductive component; the content of Ni in the conductive component is 0.01 wt.% or less. In addition, Mo as a conductive component of the via-hole conducting portion 7 and the surface conducting portion 9 is 0.5 μm or larger and smaller than 1.0 μm in average particle diameter. In other words, Mo serving as a conductive component is very fine, of which the average particle diameter is smaller than 1.0 μm and as such, the via-hole conducting portion 7 and the surface conducting portion 9 are less in defect (cavity) in each wiring line and they are extremely dense.SELECTED DRAWING: Figure 1 【課題】配線中にＮｉの含有量が少ない場合でも、配線に欠陥が生じることを抑制できるセラミックス配線基板及びその製造方法を提供すること。【解決手段】セラミック配線基板１では、ビア導電部７及び表面導電部９は、導電成分としてＭｏを含むとともに、導電成分中のＮｉの含有量が０．０１重量％以下である。さらに、ビア導電部７及び表面導電部９の導電成分であるＭｏの平均粒径は、０．５μｍ以上１．０μｍ未満である。つまり、導電成分であるＭｏの平均粒径は、１．０μｍ未満と非常に微細であるので、ビア導電部７や表面導電部９には、配線の欠陥（空隙）が少なく、非常に緻密である。【選択図】図１