SEMICONDUCTOR DEVICE
To fix two electrodes of a chip component to two adjacent leads without using a bonding material.SOLUTION: A lead 11a and a lead 11b are adjacent to each other. The lead 11a has a submerged portion 12a. The lead 11b has a submerged portion 12b. The submerged portion 12a and the submerged portion 12b...
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| Format: | Patent |
| Sprache: | eng ; jpn |
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| Zusammenfassung: | To fix two electrodes of a chip component to two adjacent leads without using a bonding material.SOLUTION: A lead 11a and a lead 11b are adjacent to each other. The lead 11a has a submerged portion 12a. The lead 11b has a submerged portion 12b. The submerged portion 12a and the submerged portion 12b face each other so as to sandwich a space Sp1. The submerged portion 12a and the submerged portion 12b are configured such that the submerged portion 12a holds an electrode E1 and the submerged portion 12b holds an electrode E2 in the housed state.SELECTED DRAWING: Figure 2
【課題】接合材を使用せずに、隣接する２つのリードに、チップ部品の２つの電極を固定する。【解決手段】リード１１ａおよびリード１１ｂは隣接している。リード１１ａは、沈め部１２ａを有する。リード１１ｂは、沈め部１２ｂを有する。沈め部１２ａおよび沈め部１２ｂが空間Ｓｐ１を挟むように、当該沈め部１２ａおよび当該沈め部１２ｂは対向している。収容状態において、沈め部１２ａが電極Ｅ１を押さえ、かつ、沈め部１２ｂが電極Ｅ２を押さえるように、当該沈め部１２ａおよび当該沈め部１２ｂは構成されている。【選択図】図２ |
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