SEMICONDUCTOR DEVICE

To improve the manufacturing quality of a semiconductor device.SOLUTION: A semiconductor device includes a first member, a second member joined via a first solder layer in a first region located on one side of the first member, and a third member joined via a second solder layer in a second region l...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	TAKAHAGI SATOSHI, IWASAKI SHINGO, HATASA KEITA
Format:	Patent
Sprache:	eng ; jpn
Schlagworte:	BASIC ELECTRIC ELEMENTS CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR PERFORMING OPERATIONS SEMICONDUCTOR DEVICES SOLDERING OR UNSOLDERING TRANSPORTING WELDING WORKING BY LASER BEAM
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